Product Name:Alumina Wafer Polishing Plate
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- Product Details:
Chemshun Alumina Wafer Polishing Plate/Turn Table is high purity 99.7-99.9%Alumina Ceramic.It's shaped by PIBM. It is one of the semiconductor industry because of its incomparable thermal and dimensional stability,and the resistance to the sever microchip-processing equipment environment. - E-Mail:
Chemshun Alumina Wafer Polishing Plate/Turn Table is high purity 99.7-99.9%Alumina Ceramic.It's shaped by PIBM. It is one of the semiconductor industry
because of its incomparable thermal and dimensional stability,and the resistance to the sever microchip-processing equipment environment.
Application:
As an important component of CMP chemical mechanical polishing process. CMP is the necessary for producing process of the sapphire and Wafer.
Chemshun Ceramics' alumina ceramics sapphire lapping wafer polishing is shaped as PIBM producing process. Its an internaltional advanced technology. PIBM sucessful solve the key problem of crack and deformation of large size alumina ceramics.PIBM technology will open another window of fine ceramics. We not only produce the high quality alumina ceramic wafer polishing plate, but also other series of large size high purity alumina ceramics such as 1200x500x20mm ceramic substrates for LCD manufacturing equipment, semiconductor delviery tracks, vacuum parts, general mechanical parts, bulletproof ceramics.
Features :
High rigidity (Hardness, Mechanical Strength, Wear Resistance)
High chemical durability
Incomparable thermal
High purity and uniformity
Surface shape & roughness control
Pretty Price
Size:
Disc, ring size below ∅850mm, thickness 45mm.
For example: D150mm, D360mm,D 600mm.
Customized products with various size are accepted.
Main Parameter : (Chemical / physical):
Property | Item | Unit | Chemshun 99.7% Alumina Ceramics |
General Properties | Main component | wt% | 99.7-99.9 |
Density | gm/cc | 3.94-3.97 | |
Color | - | Ivory | |
Water absorption | % | 0 | |
Mechanical Properties | Flexural Strength(MOR) 20 ℃ | Mpa(psix10^3) | 440-550 |
Elastic Modulus 20℃ | GPa (psix10^6) | 375 | |
Vickers Hardness | Gpa(kg/mm2) R45N | >=17 | |
Bending Strength | Gpa | 390 | |
Tensile Strength 25℃ | MPa(psix10^3) | 248 | |
Fracture Toughness (K I c) | Mpa* m^1/2 | 4-5 | |
Thermal Properities | Thermal conductivity(20℃) | W/mk | 30 |
Coefficient of Thermal expansion(25-1000℃) | 1x 10^-6/℃ | 7.6 | |
Thermal Shock Resistance | ℃(? Tc) | 200 | |
Maximum use temperature | ℃ | 1700 | |
Electrical Properities | Dielectric Strength (1MHz) | ac-kv/mm(ac v/mil) | 8.7 |
Dielectric Constant(1 MHz) | 25℃ | 9.7 | |
Volume Resistivity | ohm-cm (25℃) | >10^14 | |
ohm-cm (500℃) | 2x10^12 | ||
ohm-cm (1000℃) | 2x10^7 |
Photo Reference:
Related Keywords :
Chemical Mechanical polishing (CMP) alumina ceramic Wafer Polishing Plate / Turn Table sapphire lappingCompany name: | Please fill in your company name |
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Contact Chemshun
TEL:+86-799-6790781
FAX:+86-799-6790785
Mail:office@chemshun.com
ADD:Non-metal area of shangliuyuan, Economic development zone, pingxiang city, Jiangxi province, P.R.China
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