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[Industry News]Application of 99.7% alumina ceramic disc in CMP equipment[ 2024-02-17 16:03 ]: At present, the use of alumina ceramic grinding disc grinding semiconductor wafers is the most advanced grinding method. The double-sided grinding process is used to grind the cut wafer, and the quality of the grinding wafer is improved by improving the grinding process (disk material, grinding fluid, grinding pressure and grinding speed, etc.).; /Article/Application-of-997-alumina-ceramic-disc-in-CMP-equipment_1_1.html

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